설명
설명 없음환경 설정
Software Version: A2.1-Release CIM: SECGEM Process: LAM Metal Main System: Main System OK Handler System: LPI2200 (2) OK Factory Interface: NONE MAIN AC/SYSTEM CONTROLLER (1) OKOEM 모델 설명
The TCP 9600PTX is a high-density, low-pressure etch system from Lam Research’s TCP product line. It incorporates the company’s patented Transformer Coupled Plasma source technology for etching 0.25 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution for their advanced processing needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer configuration or in conjunction with the Alliance multi-chamber cluster platform.문서
문서 없음
LAM RESEARCH CORPORATION
TCP 9600PTX
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111958
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
TCP 9600PTX
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
111958
웨이퍼 사이즈:
8"/200mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Software Version: A2.1-Release CIM: SECGEM Process: LAM Metal Main System: Main System OK Handler System: LPI2200 (2) OK Factory Interface: NONE MAIN AC/SYSTEM CONTROLLER (1) OKOEM 모델 설명
The TCP 9600PTX is a high-density, low-pressure etch system from Lam Research’s TCP product line. It incorporates the company’s patented Transformer Coupled Plasma source technology for etching 0.25 micron and smaller geometries. It is used for metal etch applications and is designed to offer customers a reliable, lower cost of ownership solution for their advanced processing needs. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates. It is available as a stand-alone, single wafer configuration or in conjunction with the Alliance multi-chamber cluster platform.문서
문서 없음