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LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
  • LAM RESEARCH CORPORATION TCP 9600
설명
ETCH
환경 설정
환경 설정 없음
OEM 모델 설명
TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 16일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

124947


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

TCP 9600

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검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 16일 전
listing-photo-49dc866b64ec44f3bb278326fe3bedd9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

124947


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ETCH
환경 설정
환경 설정 없음
OEM 모델 설명
TCP 9600 is a high-density, low-pressure system from Lam’s TCP product line. It was introduced in late 1992 and incorporates the Company’s patented Transformer Coupled Plasma-TM- source technology for etching 0.35 micron and smaller geometries. The TCP 9600 series is designed for metal etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode. This improves etch results across a wider process window and offers customers a reliable, lower cost of ownership solution to their advanced needs.
문서

문서 없음