설명
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음
SAMCO
200C
카테고리
Dry / Plasma Etch
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
138665
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production lines환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음