설명
TEL TACTRAS with VIGUS Ix BSP Chambers Excluded Items: -ESC High Voltage (4) -DC Power Supply -SE2K Endpoint Detection Computer (1) -Electrostatic Chucks(ESC) (4)환경 설정
Handler System: Loader Module YASKAWA Model NXC100 NLM W/S (1) Options System: Nitrogen Purge Storage w/ Controller (1) Main System: VIGUS Ix BSP Chamber (4) Factory Interface: FOUP (3) Software Version: Ver. 6.80 CIM: GEM Process: MHM TrenchOEM 모델 설명
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146873
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
TACTRAS
카테고리
Dry / Plasma Etch
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146873
웨이퍼 사이즈:
12"/300mm
빈티지:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
TEL TACTRAS with VIGUS Ix BSP Chambers Excluded Items: -ESC High Voltage (4) -DC Power Supply -SE2K Endpoint Detection Computer (1) -Electrostatic Chucks(ESC) (4)환경 설정
Handler System: Loader Module YASKAWA Model NXC100 NLM W/S (1) Options System: Nitrogen Purge Storage w/ Controller (1) Main System: VIGUS Ix BSP Chamber (4) Factory Interface: FOUP (3) Software Version: Ver. 6.80 CIM: GEM Process: MHM TrenchOEM 모델 설명
Tactras™ is a 300mm plasma etch system that enhances etch process productivity. It provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. The common base product design allows Tactras™ to be built for specific applications. The etch chambers that can be installed on Tactras™ employ optimal design technologies to achieve excellent within-wafer uniformity, low wafer-to-wafer variation, and high selectivity in shaping the etch profile. Up to 6 chambers can be installed on Tactras™, each capable of handling different etch applications as required. Tactras™ offers operational advantages enabled by TEL’s cumulative knowhow on production technology, including a robust design to minimize machine-to-machine and chamber-to-chamber variation, particle reduction technology, unit-assembly inspection, and labor-saving automation. All of these contribute to customers’ productivity.문서
문서 없음