설명
Dry Etcher환경 설정
환경 설정 없음OEM 모델 설명
The UNITY® IIe is a platform designed to achieve excellent cost performance for the 130nm design rule and future technology generations. It is one of the various platforms of the UNITY®, which also includes the M and Me platforms, each designed to achieve higher productivity and reliability for specific applications. The UNITY® IIe delivers world-class process results on a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It features PE (IIe), IEM (IIe), DRM and SCCM chambers, and is available in 84, 85 and 88 models. The UNITY® IIe boasts high throughput, a compact design, lower CoO, and ease of maintenance.문서
문서 없음
TEL / TOKYO ELECTRON
UNITY IIE
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
105867
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY IIE
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
105867
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Dry Etcher환경 설정
환경 설정 없음OEM 모델 설명
The UNITY® IIe is a platform designed to achieve excellent cost performance for the 130nm design rule and future technology generations. It is one of the various platforms of the UNITY®, which also includes the M and Me platforms, each designed to achieve higher productivity and reliability for specific applications. The UNITY® IIe delivers world-class process results on a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It features PE (IIe), IEM (IIe), DRM and SCCM chambers, and is available in 84, 85 and 88 models. The UNITY® IIe boasts high throughput, a compact design, lower CoO, and ease of maintenance.문서
문서 없음