메인 콘텐츠로 건너뛰기
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기

Moov logo

Moov Icon
TEL / TOKYO ELECTRON UNITY ME
  • TEL / TOKYO ELECTRON UNITY ME
  • TEL / TOKYO ELECTRON UNITY ME
  • TEL / TOKYO ELECTRON UNITY ME
설명
Oxide
환경 설정
Oxide
OEM 모델 설명
UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.
문서

문서 없음

카테고리
Dry / Plasma Etch

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

56168


웨이퍼 사이즈:

8"/200mm


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

TEL / TOKYO ELECTRON

UNITY ME

verified-listing-icon
검증됨
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
listing-photo-319ba7a3d9d647b0ba068f6adb5d5eac-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

56168


웨이퍼 사이즈:

8"/200mm


빈티지:

2004


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Oxide
환경 설정
Oxide
OEM 모델 설명
UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.
문서

문서 없음