설명
Cassette-to-cassette wafer handling capability.환경 설정
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEM 모델 설명
미제공문서
문서 없음
ULVAC
NLD-6000
카테고리
Dry / Plasma Etch
마지막 검증일: 28일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136702
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Cassette-to-cassette wafer handling capability.환경 설정
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEM 모델 설명
미제공문서
문서 없음