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설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.문서
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
검증됨
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
40625
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
40625
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.문서
문서 없음