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APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD
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    The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.
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    카테고리
    Electro Plating

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    117049


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    모두 보기

    APPLIED MATERIALS (AMAT) / SEMITOOL

    RAIDER ECD

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    검증됨
    카테고리
    Electro Plating
    마지막 검증일: 60일 이상 전
    listing-photo-386214db1771460dbde650fc5fec2dcf-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    117049


    웨이퍼 사이즈:

    12"/300mm


    빈티지:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Raider™ ECD is a fourth-generation single wafer electrochemical deposition tool that delivers advanced metal processing in a small footprint. It is an automated, multi-process tool that is available with cluster modules for metrology, plating, and cleaning. The Raider™ incorporates programmable reactors and can provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to provide advanced metal processing capabilities in a compact and efficient package.
    문서

    문서 없음

    유사 등재물
    모두 보기