설명
ECD (Electro Chemical Deposition)환경 설정
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 모델 설명
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.문서
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LAM RESEARCH / NOVELLUS
SABRE 3D
검증됨
카테고리
Electro Plating
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56903
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
카테고리
Electro Plating
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56903
웨이퍼 사이즈:
12"/300mm
빈티지:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ECD (Electro Chemical Deposition)환경 설정
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 모델 설명
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.문서
문서 없음