설명
ELECTROPLATER, CU환경 설정
환경 설정 없음OEM 모델 설명
SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.문서
문서 없음
LAM RESEARCH / NOVELLUS
SABRE
검증됨
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101678
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / NOVELLUS
SABRE
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101678
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ELECTROPLATER, CU환경 설정
환경 설정 없음OEM 모델 설명
SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.문서
문서 없음