We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
설명
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/환경 설정
Communication Server PCB Board - Grande - PCB Assembly ManufactureOEM 모델 설명
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs문서
문서 없음
ADVANTEST
R6245
카테고리
Electronic Test
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
New
작동 상태:
알 수 없음
제품 ID:
70544
웨이퍼 사이즈:
알 수 없음
빈티지:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/환경 설정
Communication Server PCB Board - Grande - PCB Assembly ManufactureOEM 모델 설명
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs문서
문서 없음