설명
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/환경 설정
Communication Server PCB Board - Grande - PCB Assembly ManufactureOEM 모델 설명
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs문서
문서 없음
ADVANTEST
R6245
검증됨
카테고리
Electronic Test
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
New
작동 상태:
알 수 없음
제품 ID:
70544
웨이퍼 사이즈:
알 수 없음
빈티지:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ADVANTEST
R6245
카테고리
Electronic Test
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
New
작동 상태:
알 수 없음
제품 ID:
70544
웨이퍼 사이즈:
알 수 없음
빈티지:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Supplier: Grande Electronics Layers: 4 Application: Communication Server PCB Board - Grande - PCB Assembly Manufacture PCB Parameter: FR-4/HTG150 Thickness: 1.6mm Surface Treatment: ENIG Testing: 100% E-test Package: Vacuum packing Lead Time: 10-15 days Description: PCB Capabilities Layers: 1-30 Quantity: 25,000 sq.m/month PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB PCB Basic Material Brand HF: Rogers, Taconic HTG: S1000-2M, Lianmao IT180A Solder Mask: Taiyo PSR-2000/4000 Series Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger PCB Technical Parameters Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz) Min Via: 0.15mm/0.1mm(Laser) Min Annular Ring: 4mil Max copper thickness: 7oz Max size: 650x1100mm Thickness Aperture Ratio: 20: 1 Tolerance PTH: +/-0.0075mm (min: +/-0.05mm) Outline: +/-0.1mm (min: +/-0.05-0.075mm) https://www.grande-pcba.com/환경 설정
Communication Server PCB Board - Grande - PCB Assembly ManufactureOEM 모델 설명
Synchronized 2-Channel Generation, Measurement Measurement Resolution of 1 µV, 10 fA (SMU220-2), 100 pA (SMU62-20) Source Range ±220 V, ±2 A (SMU220-2, 2.4 W)/±62 V, ±20 A (SMU62-20, 140 W) Minimum Pulse Width 100 µs, Minimum Step 700 µs문서
문서 없음