설명
Indexer(indexer board) process chamber (process kits, CM, Top matcher, bottom matcher) Transfer (dip board , auto tune board PS1,PS2)환경 설정
TCP9408OEM 모델 설명
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.문서
문서 없음
LAM RESEARCH CORPORATION
TCP 9400
검증됨
카테고리
Etch/Asher
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
92147
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH CORPORATION
TCP 9400
카테고리
Etch/Asher
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
92147
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Indexer(indexer board) process chamber (process kits, CM, Top matcher, bottom matcher) Transfer (dip board , auto tune board PS1,PS2)환경 설정
TCP9408OEM 모델 설명
TCP 9400 is part of Lam’s TCP product line of high-density, low-pressure systems that were introduced in late 1992. It incorporates the Company’s patented Transformer Coupled Plasma source technology for etching 0.35 micron and smaller geometries. The TCP 9400 series is designed for polysilicon and polycide etch applications and is used to produce a broad range of advanced logic and memory devices. The system operates at lower pressures for improved pattern transfer control and higher plasma density for higher etch rates, with independent power control to the lower electrode, which improves etch results across a wider process window. The TCP system is designed to offer customers a reliable, lower cost of ownership solution to their advanced needs.문서
문서 없음