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S9
카테고리
Final Test개요
Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000
활성 등재물
2
서비스
검사, 보험, 감정, 물류
