설명
설명 없음환경 설정
EDS/ TESTOEM 모델 설명
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.문서
문서 없음
TERADYNE
CATALYST
검증됨
카테고리
Final Test
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116761
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TERADYNE
CATALYST
카테고리
Final Test
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116761
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
EDS/ TESTOEM 모델 설명
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.문서
문서 없음