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설명
Amicra Die-Bonder환경 설정
환경 설정 없음OEM 모델 설명
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control문서
문서 없음
PREFERRED
SELLER
카테고리
Flip Chip Bonders
마지막 검증일: 26일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
124492
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
ASMPT
AMICRA NOVA PLUS
카테고리
Flip Chip Bonders
마지막 검증일: 26일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
124492
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Amicra Die-Bonder환경 설정
환경 설정 없음OEM 모델 설명
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control문서
문서 없음