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환경 설정 없음OEM 모델 설명
As a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control. The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs FlipChip Bonder문서
PREFERRED
SELLER
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
64812
웨이퍼 사이즈:
알 수 없음
빈티지:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
BESI / DATACON
8800 CHAMEO advanced
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
64812
웨이퍼 사이즈:
알 수 없음
빈티지:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available