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1ChamberOEM 모델 설명
The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).문서
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BESI / DATACON
8800 CHAMEO
검증됨
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82496
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
8800 CHAMEO
카테고리
Flip Chip Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82496
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
1ChamberOEM 모델 설명
The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).문서
문서 없음