설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AVP-8000 is a vertical batch furnace with a flexible platform for diffusion, oxidation, and LPCVD processes. It is a previous version of the AVP Ace and can handle 150-200mm wafers. Some features of the AVP-8000 include a small footprint that enables side by side installation, low cost of ownership, single or dual boat configuration, and the ability to handle up to 200 wafer batches. It also has flexible substrate handling for 150mm and/or 200mm wafers, including perforated and thin/bowed wafers. Some of its applications include wet/dry thermal oxide, radical oxidation, silicon nitride (stoichiometric and low stress), TEOS, SiH4 and DCS-based SiO2, doped (P, As, B) and un-doped polysilicon, atomic layer deposition, and anneal and cure from 100 to >1200°C.문서
문서 없음
카테고리
Furnaces / Diffusion
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
145525
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
AVIZA / SVG / THERMCO
AVP 8000
카테고리
Furnaces / Diffusion
마지막 검증일: 2일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
145525
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The AVP-8000 is a vertical batch furnace with a flexible platform for diffusion, oxidation, and LPCVD processes. It is a previous version of the AVP Ace and can handle 150-200mm wafers. Some features of the AVP-8000 include a small footprint that enables side by side installation, low cost of ownership, single or dual boat configuration, and the ability to handle up to 200 wafer batches. It also has flexible substrate handling for 150mm and/or 200mm wafers, including perforated and thin/bowed wafers. Some of its applications include wet/dry thermal oxide, radical oxidation, silicon nitride (stoichiometric and low stress), TEOS, SiH4 and DCS-based SiO2, doped (P, As, B) and un-doped polysilicon, atomic layer deposition, and anneal and cure from 100 to >1200°C.문서
문서 없음