설명
FURNACE환경 설정
K type / PolyOEM 모델 설명
The Alpha-303i is a 300mm production tool developed by Tokyo Electron. It is the result of years of research and development, with TEL having completed their 300mm batch furnace prototype in 1995. Since then, TEL has delivered numerous atmospheric and LP CVD systems to multiple customer sites and consortia worldwide. The Alpha-303i includes key features such as a 100 product wafer load size, a high-speed multiple-wafer loading system with optical notch alignment, and a Front-Opening Unified Pod (FOUP) interface that is configurable for overhead transfer systems (OHT) and personal guided vehicles (PGV). Additionally, boat rotation is standard on all processes, and a Fast Thermal Processing System (FTP) is available for both atmospheric and CVD systems. This tool reinforces TEL’s commitment to being production ready for the 300mm era of semiconductor manufacturing.문서
문서 없음
TEL / TOKYO ELECTRON
ALPHA(α)-303i
검증됨
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51950
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기TEL / TOKYO ELECTRON
ALPHA(α)-303i
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51950
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
FURNACE환경 설정
K type / PolyOEM 모델 설명
The Alpha-303i is a 300mm production tool developed by Tokyo Electron. It is the result of years of research and development, with TEL having completed their 300mm batch furnace prototype in 1995. Since then, TEL has delivered numerous atmospheric and LP CVD systems to multiple customer sites and consortia worldwide. The Alpha-303i includes key features such as a 100 product wafer load size, a high-speed multiple-wafer loading system with optical notch alignment, and a Front-Opening Unified Pod (FOUP) interface that is configurable for overhead transfer systems (OHT) and personal guided vehicles (PGV). Additionally, boat rotation is standard on all processes, and a Fast Thermal Processing System (FTP) is available for both atmospheric and CVD systems. This tool reinforces TEL’s commitment to being production ready for the 300mm era of semiconductor manufacturing.문서
문서 없음