설명
Btah환경 설정
FN_SiN(DRAM)OEM 모델 설명
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.문서
문서 없음
카테고리
Furnaces / Diffusion
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144998
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
TELFORMULA
카테고리
Furnaces / Diffusion
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144998
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Btah환경 설정
FN_SiN(DRAM)OEM 모델 설명
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.문서
문서 없음