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MLD Nitride Furnace환경 설정
MLD Nitride FurnaceOEM 모델 설명
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.문서
문서 없음
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56306
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
TELINDY PLUS IRad
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56306
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
MLD Nitride Furnace환경 설정
MLD Nitride FurnaceOEM 모델 설명
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.문서
문서 없음