설명
Btah환경 설정
IBS_HiCurOEM 모델 설명
The SEN Corporation / Sumitomo NV-GSD-HC3 is a high current ion implantation system designed for the efficient and high-volume production of devices such as DRAMs using 300 mm wafers. This model excels in ultra-low energy applications, offering implantation energy as low as 0.2 keV up to 80 keV. It ensures high current with minimal energy contamination through a deceleration mechanism, making it suitable for delicate processes down to 0.2 keV. The system features a high-performance, long-life ion source (ELS) for consistent performance. It provides high accuracy of implantation with excellent beam quality, minimizing metal contamination and cross-contamination using advanced technologies like the VSD (Virtual Slit Disk) and TSDF (Triple Surface Disk Faraday). Additionally, a plasma shower system minimizes charge buildup, enhancing process stability.문서
문서 없음
카테고리
High Current
마지막 검증일: 9일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144876
웨이퍼 사이즈:
12"/300mm
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEN CORPORATION / SUMITOMO
NV GSD HC3
카테고리
High Current
마지막 검증일: 9일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
144876
웨이퍼 사이즈:
12"/300mm
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Btah환경 설정
IBS_HiCurOEM 모델 설명
The SEN Corporation / Sumitomo NV-GSD-HC3 is a high current ion implantation system designed for the efficient and high-volume production of devices such as DRAMs using 300 mm wafers. This model excels in ultra-low energy applications, offering implantation energy as low as 0.2 keV up to 80 keV. It ensures high current with minimal energy contamination through a deceleration mechanism, making it suitable for delicate processes down to 0.2 keV. The system features a high-performance, long-life ion source (ELS) for consistent performance. It provides high accuracy of implantation with excellent beam quality, minimizing metal contamination and cross-contamination using advanced technologies like the VSD (Virtual Slit Disk) and TSDF (Triple Surface Disk Faraday). Additionally, a plasma shower system minimizes charge buildup, enhancing process stability.문서
문서 없음