설명
Conditions: can be powered on.환경 설정
환경 설정 없음OEM 모델 설명
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.문서
문서 없음
ACCRETECH / TOSEI
W-GM-4250
검증됨
카테고리
Lapping, Polishing, Grinding
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113430
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
ACCRETECH / TOSEI
W-GM-4250
카테고리
Lapping, Polishing, Grinding
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113430
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Conditions: can be powered on.환경 설정
환경 설정 없음OEM 모델 설명
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.문서
문서 없음