설명
Through the integrated on-line system, a more secure wafer thinning technology is realized The equipment is a wafer applicator which pastes the cp 300 mm thin crystal figure on the cutting frame and then peels off the protective film on its surface. Through the on-line system composed of the back grinding machine and polishing machine (dgp8761, dfg8560, dfp8160), a series of manufacturing procedures can be safely and reliably operated from the thin type grinding and machining of Jingguo, then pasted on the cutting frame t and finally peeled off the surface protective film, realizing the continuous automatic production. Because Coke needs to be handled manually, the wafer transfer between stock and reserve can be carried out more safely, which helps to improve the yield of thin processing technology. Applicable to various OAF film technologies With the increasing popularity of siip (system in package), the OAF (dieattach film) device necessary for the implementation of lamination in recent years is also built in this die. In the device, OAF is pre cut, then pasted on the wafer, and the protective film is peeled off. In this way, the super thin OAF below 25 um can be pasted. In addition, it is also suitable for cutting OAF film integrated with adhesive film. (the heating device of wafer mounting platform is specially selected) Workflow system Accept the work object sent from the back grinding overview letter, or CD "take the work object out of the star cluster box + @ carry the work object to the detection platform (any) and pack the surface retaining ring membrane for UV (press outside the case) shooting (when using the UVB membrane) Positioning and calibration through image processing ,_ Paste DAF (dleattach film) onto the wafer one® finish the work of DAF pasting and apply secondary hardening one Use the cutting button film to install the work object on the cutting frame ,_ @ peel off the surface protective film ,_ @ put it into the cutting frame Pulp box Rich special options A variety of special parts are prepared for use, including a pre cutting device which can cut the uncut cutting adhesive film inside the equipment; In addition to the use of standard Shuwei adhesive film to peel off the surface protective adhesive film, there are also adhesive film peeling devices with adhesive film Baoshi: in addition, there is a bar code lbraid recognition system, which can batch the ID of the surface of the crystal diagram, print the alkali into purl in, and then paste it on the cutting glue after the wafer is pasted. Save floor space Dfm2700 replaces the manual handling system in the original brain computer system with a built-in general arm to transmit the crystal diagram among the equipment, and slows down the design of the internal terrorism of the equipment, thus greatly saving the equipment's floor space. Can operate as an independent device It can also be operated as a stand-alone device by using the usual crystal state storage box and DSC (double slot asetne8).환경 설정
DFM2700+8760OEM 모델 설명
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.문서
문서 없음
DISCO
DFM2700
검증됨
카테고리
Lapping, Polishing, Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79183
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFM2700
카테고리
Lapping, Polishing, Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79183
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Through the integrated on-line system, a more secure wafer thinning technology is realized The equipment is a wafer applicator which pastes the cp 300 mm thin crystal figure on the cutting frame and then peels off the protective film on its surface. Through the on-line system composed of the back grinding machine and polishing machine (dgp8761, dfg8560, dfp8160), a series of manufacturing procedures can be safely and reliably operated from the thin type grinding and machining of Jingguo, then pasted on the cutting frame t and finally peeled off the surface protective film, realizing the continuous automatic production. Because Coke needs to be handled manually, the wafer transfer between stock and reserve can be carried out more safely, which helps to improve the yield of thin processing technology. Applicable to various OAF film technologies With the increasing popularity of siip (system in package), the OAF (dieattach film) device necessary for the implementation of lamination in recent years is also built in this die. In the device, OAF is pre cut, then pasted on the wafer, and the protective film is peeled off. In this way, the super thin OAF below 25 um can be pasted. In addition, it is also suitable for cutting OAF film integrated with adhesive film. (the heating device of wafer mounting platform is specially selected) Workflow system Accept the work object sent from the back grinding overview letter, or CD "take the work object out of the star cluster box + @ carry the work object to the detection platform (any) and pack the surface retaining ring membrane for UV (press outside the case) shooting (when using the UVB membrane) Positioning and calibration through image processing ,_ Paste DAF (dleattach film) onto the wafer one® finish the work of DAF pasting and apply secondary hardening one Use the cutting button film to install the work object on the cutting frame ,_ @ peel off the surface protective film ,_ @ put it into the cutting frame Pulp box Rich special options A variety of special parts are prepared for use, including a pre cutting device which can cut the uncut cutting adhesive film inside the equipment; In addition to the use of standard Shuwei adhesive film to peel off the surface protective adhesive film, there are also adhesive film peeling devices with adhesive film Baoshi: in addition, there is a bar code lbraid recognition system, which can batch the ID of the surface of the crystal diagram, print the alkali into purl in, and then paste it on the cutting glue after the wafer is pasted. Save floor space Dfm2700 replaces the manual handling system in the original brain computer system with a built-in general arm to transmit the crystal diagram among the equipment, and slows down the design of the internal terrorism of the equipment, thus greatly saving the equipment's floor space. Can operate as an independent device It can also be operated as a stand-alone device by using the usual crystal state storage box and DSC (double slot asetne8).환경 설정
DFM2700+8760OEM 모델 설명
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.문서
문서 없음