설명

Double Side Polishing Machine

환경 설정

Double Side Polishing Machine Wafer processing host: double-sided polishing machine Wafer loading and unloading mechanism: Auto Loading & Unloading System Functional description: 1) Processing object: 12-inch silicon wafer 2) Processing principle: While supplying the polishing liquid, the high-speed rotating polishing plate, polishing cloth and polishing liquid perform high-precision double-sided flat polishing on the wafer surface, eliminating the damaged layer left on the silicon wafer surface from previous processing. Composition: 1) Processing host: double-sided polishing machine body 2) Wafer loading and unloading mechanism: Auto Loading & Unloading System Accessories: 3) Polishing liquid supply system 4) Surfactant supply system 5) High-pressure water supply system 6) Platen cooling system Device dimensions: 2178mm × 4716mm × 3283.5mm Weight: Approx. 13,000 Kg Auto Loading Unloading System Functional description: 1) Processing object: 12-inch silicon wafer 2) Processing principle: The silicon wafer loading box is placed in the box setting area, and the robotic arm automatically takes out the wafers from the loading box one by one, confirms the position, and loads them into the wafer holes of the planetary wheel. After the double-sided flat polishing operation, the robotic arm automatically retrieves the wafers from the wafer holes of the planetary wheel one by one and returns them to the wafer recovery and storage mechanism. Composition: 1) Loading box setting area 2) Wafer mapping mechanism 3) Automatic wafer pick-up and placement robot arm 4) Wafer hole scanning mechanism 5) Robot arm suction plate moisturizing mechanism 6) Wafer recovery storage/transportation mechanism Device dimensions: 1850mm × 1616mm × 2626mm Weight: Approx. 2,000 Kg