메인 콘텐츠로 건너뛰기
Moov logo

Moov Icon
3D-MICROMAC microPRO XS
    설명
    Condition: Complete / Working at removal Status: De-installed / warehoused
    환경 설정
    3D MICROMAC microPRO XS Configured: 200mm Included features: Housing Laser Class 1 IR picosecond laser for Filamentation Filamentation fixed optic One working area High precision positioning system Power measurement at workpiece level Alignment camera Active exhaust system Control software micro Material / Workpiece for Filamentation glass cutting: Product Thickness: 0.05 - 2mm Material: unstrengthened or chemical strengthened glass, raw glass Loading/unloading: Cleave Technology Peackage Windows 10 base
    OEM 모델 설명
    Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.
    문서

    문서 없음

    3D-MICROMAC

    microPRO XS

    verified-listing-icon

    검증됨

    카테고리
    Laser

    마지막 검증일: 13일 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    Installed / Idle


    제품 ID:

    102695


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2020

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기

    유사 등재물 없음

    3D-MICROMAC

    microPRO XS

    verified-listing-icon
    검증됨
    카테고리
    Laser
    마지막 검증일: 13일 전
    listing-photo-d626d2b2619942249d286cf73856b467-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77484/d626d2b2619942249d286cf73856b467/ea2093fb2751455bb4cd8caa7781bbf4_3dmicromacdicer1_mw.jpg
    listing-photo-d626d2b2619942249d286cf73856b467-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77484/d626d2b2619942249d286cf73856b467/e0e1c664ed7e4ad8bd704c5a7a411f41_3dmicromacdicer2_mw.jpg
    listing-photo-d626d2b2619942249d286cf73856b467-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77484/d626d2b2619942249d286cf73856b467/2553ef61a14c45099811f0c28daa14f3_image1_mw.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    Installed / Idle


    제품 ID:

    102695


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2020


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Condition: Complete / Working at removal Status: De-installed / warehoused
    환경 설정
    3D MICROMAC microPRO XS Configured: 200mm Included features: Housing Laser Class 1 IR picosecond laser for Filamentation Filamentation fixed optic One working area High precision positioning system Power measurement at workpiece level Alignment camera Active exhaust system Control software micro Material / Workpiece for Filamentation glass cutting: Product Thickness: 0.05 - 2mm Material: unstrengthened or chemical strengthened glass, raw glass Loading/unloading: Cleave Technology Peackage Windows 10 base
    OEM 모델 설명
    Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.
    문서

    문서 없음

    유사 등재물
    모두 보기

    유사 등재물 없음