설명
Condition: Complete / Working at removal Status: De-installed / warehoused환경 설정
3D MICROMAC microPRO XS Configured: 200mm Included features: Housing Laser Class 1 IR picosecond laser for Filamentation Filamentation fixed optic One working area High precision positioning system Power measurement at workpiece level Alignment camera Active exhaust system Control software micro Material / Workpiece for Filamentation glass cutting: Product Thickness: 0.05 - 2mm Material: unstrengthened or chemical strengthened glass, raw glass Loading/unloading: Cleave Technology Peackage Windows 10 baseOEM 모델 설명
Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.문서
문서 없음
3D-MICROMAC
microPRO XS
검증됨
카테고리
Laser
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
102695
웨이퍼 사이즈:
8"/200mm
빈티지:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
3D-MICROMAC
microPRO XS
카테고리
Laser
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
102695
웨이퍼 사이즈:
8"/200mm
빈티지:
2020
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Condition: Complete / Working at removal Status: De-installed / warehoused환경 설정
3D MICROMAC microPRO XS Configured: 200mm Included features: Housing Laser Class 1 IR picosecond laser for Filamentation Filamentation fixed optic One working area High precision positioning system Power measurement at workpiece level Alignment camera Active exhaust system Control software micro Material / Workpiece for Filamentation glass cutting: Product Thickness: 0.05 - 2mm Material: unstrengthened or chemical strengthened glass, raw glass Loading/unloading: Cleave Technology Peackage Windows 10 baseOEM 모델 설명
Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음