설명
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.환경 설정
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment PackageOEM 모델 설명
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.문서
문서 없음
카테고리
Lithography
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
115928
웨이퍼 사이즈:
알 수 없음
Laser:
442
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
HEIDELBERG INSTRUMENTS
DWL 66
카테고리
Lithography
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
115928
웨이퍼 사이즈:
알 수 없음
Laser:
442
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.환경 설정
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment PackageOEM 모델 설명
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.문서
문서 없음