설명
possible exposure to Gold환경 설정
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 모델 설명
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.문서
문서 없음
VEECO / ULTRATECH
AP300
검증됨
카테고리
Lithography
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18575
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
VEECO / ULTRATECH
AP300
검증됨
카테고리
Lithography
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
18575
웨이퍼 사이즈:
12"/300mm
빈티지:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
possible exposure to Gold환경 설정
2.0 um, Extended Field, ghi-line Broadband Lens � Dual 1200 W Lamp Illuminator Universal Size/Warped Wafer Kit: 200, and 300mm. FOSB Cassette to Cassette Wafer Handling Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System MVS Alignment Spectrum of 530 - 570 nm Lens Distortion Reference - No lens matching 6 Slot Reticle Stack, Manual Front Loading GEM HSMS Communications Power Source: 208 V three phase, 5 wire, 150 amp Environmental ChamberOEM 모델 설명
The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.문서
문서 없음