설명
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton환경 설정
환경 설정 없음OEM 모델 설명
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.문서
문서 없음
카테고리
Mask/Bond Aligners
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136205
웨이퍼 사이즈:
8"/200mm
빈티지:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA300 Plus
카테고리
Mask/Bond Aligners
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
136205
웨이퍼 사이즈:
8"/200mm
빈티지:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton환경 설정
환경 설정 없음OEM 모델 설명
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.문서
문서 없음