설명
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.환경 설정
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 모델 설명
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SONIX
QUANTUM 350
검증됨
카테고리
Microscope
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55840
웨이퍼 사이즈:
8"/200mm
빈티지:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SONIX
QUANTUM 350
카테고리
Microscope
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
55840
웨이퍼 사이즈:
8"/200mm
빈티지:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.환경 설정
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 모델 설명
미제공문서
문서 없음