설명
TSV Cu Anneal환경 설정
TSV Cu AnnealOEM 모델 설명
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.문서
문서 없음
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
검증됨
카테고리
Oven
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75747
웨이퍼 사이즈:
12"/300mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
검증됨
카테고리
Oven
마지막 검증일: 20일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
75747
웨이퍼 사이즈:
12"/300mm
빈티지:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
TSV Cu Anneal환경 설정
TSV Cu AnnealOEM 모델 설명
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.문서
문서 없음