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KLA-5100XP Super precision measurement devise

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-Process: Superposition measuring device -SMIF Interface: None System configuration KLA-5100 (Superposition measuring device) Inspection Station Alignment system: KLAASP automatic alignment system Stage system: 2-stage high-precision stage (piezo crystal control) Focus system: 2-stage Z-axis operation (piezo crystal control) Optics: LINNIK optics Wafer Loader Systems Transport system: 2 cassette loader / unloader - Pre-alignment: OF detection function Control Console Menu Terminal Image Display Terminal KLA-5501 Analysis Station DEC　VLC4000 16MB　RAM 320/525MB　QIC　tape　drive 3.5inch　F.D.drive(IBM　PC　互換　1.44M) option KLASS III Software Package Image Hard Copy Printer (LA75 equivalent) SECS Software 26-wafer compatible option Patlite 2GB　Hard　Disk Library　Setup Basic equipment specifications Wafer Size Wafer Diameter (mm): 200 Wafer thickness (μm): 725 Wafer Pattern For orifura, the pattern is aligned within 2° For wafer sizes of 100 mm or more, 9 patterns are attached to at least 82 mm in both X and Y directions. At least two or more chips are exposed in the Y direction Die Size Minimum 3 mm, maximum 50 mm (one side) Wafer Conveyance Capable of processing 2 SEMI standard 25-piece cassettes Measurement wafer designation is randomly programmable Wafer Alignment Fully automatic non-contact alignment method that does not require special alignment targets Targets for superposition accuracy measurement (1) Concentric box-type targets (2) The outer target is 15μm or more and 30μm or less (recommended size: 20μm) (3) The inner target is about 1/2 the size of the outer target (4) The angle of inclination of the edge of the target is 80~90° Measurement accuracy (using KLA Stsdard Wafer) Repeatability (3 sigma) 5 nm or less (when superposition error 2 μm or less) TIS (Tool Induced Shift) (using KLA Standard Wefer) The TIS value measured by the following equation is 5 nm or less. TIS=(X0+X180)/2　TISY(Y0+Y180)/2 The average of X and Y superposition deviations is X0 and Y0, respectively. The average of X and Y superposition deviations measured by rotating the wafer 180 ° is X180 and Y180, respectively. Measurement throughput 85 or more sheets per hour (when measuring 5 points in the wafer plane) data processing Various statistical calculations and graphic display are possible Utility power 50/60Hz AC200V 20A Single Phase 1 System 100V AC 20A Single Phase 1 System 4pcs for Monitor/Printer/Maintenance Clean dry air or dry N2 (dew point -40°C, 2μm filter required) 1 piece for KLA-5100 Flow rate: 84.9l/min, pressure 603kg/cm2~7.7kg/cm2 1/4 inch tube vacuum 3 pcs for KLA-5100 Vacuum: 635mmHg, Flow rate: 28.3l/min 1/4 inch tube exhaust 1 4.5inch (115mm) Φ duct system Flow rate: 250cfm (7m3/min or more) Temperature environment 19°C~25°C Fluctuation of ambient temperature of equipment ±0.8°C vibration Attached Vibration chart reference External dimensions and weight KLA5100 Inspection Station 1340mm(W)×1200mm(D)×1700mm(H)　1000kg Control Console 560mm(W)×900mm(D)×2000mm(H)　80kg Line Conditioner 310mm(W)×550mm(D)×270mm(H)　50kg