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SUNBIRD
카테고리
Packaging개요
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음