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BRUKER FilmTek 2000M TSV
  • BRUKER FilmTek 2000M TSV
  • BRUKER FilmTek 2000M TSV
  • BRUKER FilmTek 2000M TSV
설명
Film Thickness Measuremeny
환경 설정
환경 설정 없음
OEM 모델 설명
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).
문서

문서 없음

카테고리
Packaging

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

82042


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

BRUKER

FilmTek 2000M TSV

verified-listing-icon
검증됨
카테고리
Packaging
마지막 검증일: 60일 이상 전
listing-photo-d5bcf45e8ba445e9864b6dac7e08373c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

82042


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Film Thickness Measuremeny
환경 설정
환경 설정 없음
OEM 모델 설명
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).
문서

문서 없음