설명
설명 없음환경 설정
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEM 모델 설명
미제공문서
문서 없음
LINTEC
RAD-3510F/12
검증됨
카테고리
Packaging
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
89447
웨이퍼 사이즈:
알 수 없음
빈티지:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LINTEC
RAD-3510F/12
카테고리
Packaging
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
89447
웨이퍼 사이즈:
알 수 없음
빈티지:
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEM 모델 설명
미제공문서
문서 없음