설명
Chemical vapor deposition환경 설정
환경 설정 없음OEM 모델 설명
The Applied Materials AKT1600 is a panel etcher and panel deposition tool with four loading ports, two vacuum load locks, and five chambers. Two chambers (A and B) are designated for etching, processing a maximum of two panels at a time. Etch Chamber A is used primarily for etching silicon nitrate (SiN) while Etch Chamber B is used to etch aluminum (Al), molybdenum (Mo), indium tin oxide (ITO) and amorphous silicon (a-Si). The three deposition chambers are single panel chambers. Chamber D is used to deposit SiN and a-Si. Chamber C is used to deposit material doped n-type and chamber E to deposit materials doped p-type although both chambers can also deposit un-doped amorphous silicon. The AKT 1600 plasma enhanced chemical vapor deposition (PECVD) system is a powerful vacuum system used to convert reactive gaseous species into a solid film. With its advanced capabilities and versatility, the AKT 1600 PECVD system is an essential tool for the fabrication of high-quality solar cells.문서
문서 없음
APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)
1600 PECVD
검증됨
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
61853
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT)
1600 PECVD
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
61853
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Chemical vapor deposition환경 설정
환경 설정 없음OEM 모델 설명
The Applied Materials AKT1600 is a panel etcher and panel deposition tool with four loading ports, two vacuum load locks, and five chambers. Two chambers (A and B) are designated for etching, processing a maximum of two panels at a time. Etch Chamber A is used primarily for etching silicon nitrate (SiN) while Etch Chamber B is used to etch aluminum (Al), molybdenum (Mo), indium tin oxide (ITO) and amorphous silicon (a-Si). The three deposition chambers are single panel chambers. Chamber D is used to deposit SiN and a-Si. Chamber C is used to deposit material doped n-type and chamber E to deposit materials doped p-type although both chambers can also deposit un-doped amorphous silicon. The AKT 1600 plasma enhanced chemical vapor deposition (PECVD) system is a powerful vacuum system used to convert reactive gaseous species into a solid film. With its advanced capabilities and versatility, the AKT 1600 PECVD system is an essential tool for the fabrication of high-quality solar cells.문서
문서 없음