설명

Number of Chambers 3 (A, B, C, D): 3(A, B, C) Load Locks LL1, LL2: LL1, LL2 Transfer Chamber: Vacuum Robot Process Chambers eXT Metal Etch Chambers: eXT Metal Cu Etch RF Generator: 13.56 MHz / Bias RF Vacuum: Pump Turbo ESC Type: Electrostatic Chuck Temperature: Backside He Cooling Endpoint Detection: Optical Emission Spectroscopy (if equipped) Factory Interface: EFEM + FOUP Load Ports Communications: SECS/GEM, GEM300 Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum Safety Systems: Gas Monitoring, Interlocks, EMO Chamber Process PM1: Metal Main Etch PM2: Metal Main Etch PM3: Metal Main Etch Chillers: Nil Monitor: 3 sets Does not include: Dry pumps, Chillers, HDD.