설명
설명 없음환경 설정
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음
OXFORD
PLASMALAB 100
검증됨
카테고리
PECVD
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116992
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
OXFORD
PLASMALAB 100
카테고리
PECVD
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
116992
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음