설명
설명 없음환경 설정
1. Process module (ICP-RIE Etch, PECVD) . Process Chamber Inside 2. Loadlock (outside & Inside) 3. Gas Supply (ICP-RIE Etch, PECVD) -Gas Supply (for ICP-RIE Etch) ✓ HBr 50sccm ✓ BCl3 50sccm ✓ Cl2 50sccm ✓ SF6 100sccm ✓ Ar 100sccm ✓ O2 100sccm -Gas Supply (for PECVD) ✓ 5%SiH4/N2 1000sccm ✓ NH3 50sccm ✓ N2O 2000sccm ✓ N2 2000sccm ✓ O2 200sccm ✓ CF4 500sccm 4. Chiller 5. Power Transfer 6. PC * Pump : not includedOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
OXFORD
PLASMALAB 100
검증됨
카테고리
PECVD
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103544
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
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Money Back Guarantee
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Refurbishment Services
Available
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OXFORD
PLASMALAB 100
카테고리
PECVD
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103544
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available