설명
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though환경 설정
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음
카테고리
PECVD
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
137095
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기OXFORD
PLASMALAB 100
카테고리
PECVD
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
137095
웨이퍼 사이즈:
알 수 없음
빈티지:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Oxford Plasmalab 100 RIE/ICP 380 He backside cooling – chiller broken though환경 설정
Mainly used for R/D - etching different compound semiconductors, like SiC, GaAs, InP ICP380 - Up to 5kW PLC upgraded to X20 around 2016 Single wafer loadlock – can handle up to 8” wafers, Quartz clamping of wafer He backside cooling – chiller broken though 12 gasline gas pod, 8 gas lines used, SiCl4, Cl2, CH4, Ar, O2, N2, SF6, H2 LL pump – Alcatel 2021 SD + Pfeiffer Hipace 80 turbopump Chamber pump: Adixen Pascal 2063 (fomblin oil) + ATP900 turbo pumpOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음