설명
Complete, Working Condition, with no missing parts. Last used Q1 2023환경 설정
PECVD Gases: Ar - 500 sccm NH3 - 50 sccm 5%SiH4/N2 - 1000 sccm CF4 - 500 sccm O2 - 500 sccm N2O - 2000 sccm N2 - 2000 sccm CB1 - Main Circuit Breaker CB2 - PSU CB3 - Not Used CB4 - RF Generator CB5 - LF Generator CB6 - TEOS CB7 - Not Used CB8 - Foreline Heat CB9 - Table Heat CB10 - Chamber Heat CB11 - Pumpdown Heat CB12 - Chamber Pump CB13 - Loadlock Pump CB14 - Not UsedOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음
OXFORD
PLASMALAB 100
검증됨
카테고리
PECVD
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
81699
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
OXFORD
PLASMALAB 100
카테고리
PECVD
마지막 검증일: 15일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Idle
제품 ID:
81699
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Complete, Working Condition, with no missing parts. Last used Q1 2023환경 설정
PECVD Gases: Ar - 500 sccm NH3 - 50 sccm 5%SiH4/N2 - 1000 sccm CF4 - 500 sccm O2 - 500 sccm N2O - 2000 sccm N2 - 2000 sccm CB1 - Main Circuit Breaker CB2 - PSU CB3 - Not Used CB4 - RF Generator CB5 - LF Generator CB6 - TEOS CB7 - Not Used CB8 - Foreline Heat CB9 - Table Heat CB10 - Chamber Heat CB11 - Pumpdown Heat CB12 - Chamber Pump CB13 - Loadlock Pump CB14 - Not UsedOEM 모델 설명
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces문서
문서 없음