설명
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4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEM 모델 설명
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.문서
문서 없음
PANASONIC
NPM-W2
검증됨
카테고리
Pick and Place
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
94011
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PANASONIC
NPM-W2
카테고리
Pick and Place
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
94011
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEM 모델 설명
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.문서
문서 없음