메인 콘텐츠로 건너뛰기
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기

Moov logo

Moov Icon
ROYCE INSTRUMENTS DE-35
  • ROYCE INSTRUMENTS DE-35
설명
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION
환경 설정
환경 설정 없음
OEM 모델 설명
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.
문서

문서 없음

카테고리
Pick and Place

마지막 검증일: 60일 이상 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

63979


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ROYCE INSTRUMENTS

DE-35

verified-listing-icon
검증됨
카테고리
Pick and Place
마지막 검증일: 60일 이상 전
listing-photo-01f3e8d8dee64125971166c763502055-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1116/01f3e8d8dee64125971166c763502055/2a589b1957c64ab4b528b5be497f3dbf_copyimg202010301506411_mw.jpeg
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

63979


웨이퍼 사이즈:

알 수 없음


빈티지:

알 수 없음


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION
환경 설정
환경 설정 없음
OEM 모델 설명
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.
문서

문서 없음