설명
설명 없음환경 설정
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM 모델 설명
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.문서
문서 없음
ACCRETECH / TSK
PG300RM
검증됨
카테고리
Polishing and Grinding
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56213
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG300RM
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56213
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM 모델 설명
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.문서
문서 없음