설명
설명 없음환경 설정
DFM2700+8760OEM 모델 설명
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.문서
문서 없음
DISCO
DFM2700
검증됨
카테고리
Polishing and Grinding
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79183
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFM2700
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
79183
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
DFM2700+8760OEM 모델 설명
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.문서
문서 없음