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DISCO DFP8140
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    The DFP8140 is a fully automatic polisher made by DISCO Corporation. It is a dry polisher for Φ8-inch wafers with chemical-free stress relief. This dry polisher can remove the grinding damage layer on the backsides of wafers up to Φ8 inches without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. The DFP8140 is designed to polish wafers of diameter Φ4/5/6/8 inch (select one size) using an anomalous in-feed grinding with wafer rotation method. It uses a Φ300 mm dry polishing wheel and a porous chuck table with vacuum chuck-method. The chuck table has a revolution speed range of 0-300 min-1 and is cleaned using water & air thrust up, leveling stone and brush cleaning. The spindle has an output of 4.8 kW and a revolution speed range of 1,000-4,000 min-1. The machine dimensions are 1,200 × 2,670 × 1,800 mm (W×D×H) and it weighs approximately 1,900 kg.
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    DISCO

    DFP8140

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    검증됨

    카테고리

    Polishing and Grinding
    마지막 검증일: 30일 이상 전
    주요 품목 세부 정보

    조건:

    Used


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    제품 ID:

    101711


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    빈티지:

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    DISCO DFP8140
    DISCODFP8140Polishing and Grinding
    빈티지: 0조건: 중고
    마지막 검증일30일 이상 전

    DISCO

    DFP8140

    verified-listing-icon

    검증됨

    카테고리

    Polishing and Grinding
    마지막 검증일: 30일 이상 전
    listing-photo-2779020607bd40b9bf83cc38cf6effa1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    101711


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The DFP8140 is a fully automatic polisher made by DISCO Corporation. It is a dry polisher for Φ8-inch wafers with chemical-free stress relief. This dry polisher can remove the grinding damage layer on the backsides of wafers up to Φ8 inches without slurry. This process greatly reduces wafer breakage and warpage and improves die strength and product yield. The DFP8140 is designed to polish wafers of diameter Φ4/5/6/8 inch (select one size) using an anomalous in-feed grinding with wafer rotation method. It uses a Φ300 mm dry polishing wheel and a porous chuck table with vacuum chuck-method. The chuck table has a revolution speed range of 0-300 min-1 and is cleaned using water & air thrust up, leveling stone and brush cleaning. The spindle has an output of 4.8 kW and a revolution speed range of 1,000-4,000 min-1. The machine dimensions are 1,200 × 2,670 × 1,800 mm (W×D×H) and it weighs approximately 1,900 kg.
    문서

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    유사 등재물
    모두 보기
    DISCO DFP8140
    DISCO
    DFP8140
    Polishing and Grinding빈티지: 0조건: 중고마지막 검증일: 30일 이상 전