설명
Fully automatic in-feed surface grinder/polisher환경 설정
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
문서 없음
DISCO
DGP8760
검증됨
카테고리
Polishing and Grinding
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
72740
웨이퍼 사이즈:
6"/150mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DGP8760
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
72740
웨이퍼 사이즈:
6"/150mm
빈티지:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Fully automatic in-feed surface grinder/polisher환경 설정
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM 모델 설명
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.문서
문서 없음