설명
As is & No Missing환경 설정
환경 설정 없음OEM 모델 설명
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.문서
문서 없음
DISCO
DGP8761
검증됨
카테고리
Polishing and Grinding
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
96716
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DGP8761
검증됨
카테고리
Polishing and Grinding
마지막 검증일: 4일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
96716
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
As is & No Missing환경 설정
환경 설정 없음OEM 모델 설명
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.문서
문서 없음