We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
설명
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function환경 설정
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 모델 설명
미제공문서
문서 없음
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
New
작동 상태:
알 수 없음
제품 ID:
89683
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
AP3000e
카테고리
Probers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
New
작동 상태:
알 수 없음
제품 ID:
89683
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask Function환경 설정
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM 모델 설명
미제공문서
문서 없음